In electronic encapsulation, it is essential to use the right equipment and potting compound that will exactly meet all the requirements. Potting compounds are usually epoxies that play a vital role in protecting electronic components over a long period. They have excellent thermal, mechanical, electrical, and adhesive properties. Each compound offers varied levels of protection, which is why it is essential to choose the right one depending on the level and type of protection required.
Factors to consider
The choice of potting compound for electronic encapsulation is usually dictated by the type of protection the component requires. In some cases, components may require extra protection from shock and vibrations while others may require to be well protected from moisture and chemicals. Failure to provide proper encapsulation can lead to component damage. It is also essential to understand design process in order to reduce the risk of errors. Different types of potting compounds have varied resistance to high temperatures. Therefore, it is essential to determine the thermal conditions and consider factors such as dwell and ramp times in addition to the variance in temperature expected. In vacuum encapsulation some epoxies can withstand extremely high temperatures as much as 250 degrees centigrade in short bursts. Failure to choose the right potting compound that meets temperature requirements could result in cracks during thermal cycling.
Vacuum encapsulation – a cost effective solution
Vacuum encapsulation is one of the most widely used processes in the packaging industry. While the plasma process is used to improve the surface chemistry of substrates, encapsulation offers it allows for a reliable, stable, and affordable way to protect a wide range of components including biomedical micro systems, pressure sensors, optical communication systems, and more. Traditional forms of packaging involve the use of expensive ceramic containers while packaging is applied to individual devices at the end of a process. This increases the risk of damage and costs as well. On the other hand, vacuum impregnation equipment is specially designed to dispense accurate, metered shots in a controlled vacuum environment that eliminates all air voids and results in high quality Visit Website.
Types of encapsulation equipment
Encapsulation equipment with special vacuum chambers is usually designed to customer specifications. The process is designed to ensure a higher degree of integrity and reliability where components can handle greater stress, improve product quality, and production rates. Encapsulation equipment includes a range of desktop and floor standing models. Desktop equipment is ideal for potting and encapsulating small electronic components. Some of the applications suited to this type of system include optic sensors and automotive electronic ignition modules, to name a few. On the other hand, floor standing equipment offers a great deal of flexibility and is classified as fixed or variable ratio. They allow for consistent shots even in the most demanding assembly line applications. These units can be operated in manual, semi-automatic, and automatic modes. Some of the typical applications include television transformers, electronic ignition coils, impedance coils, submersible pumps, and more.